Digital Campus

Digital Campus was an interdisciplinary project to improve the access teaching and support services of German universities to diverse groups of international students by digital means in order to improve the integration of students into university curriculae based on their individual needs and continues its predecessor project IMPactDigital (BMBF, 2019).

In IMPactDigital, COMSYS developed a concept for a blockchan-based infrastructure for sharing educational resources across university borders to incentizive a sustainable culture of collaboration between university teachers instead of avoidable concurrency when it comes to create teaching material such as lecture slides and scripts or exercise tasks up to high-quality exam tasks. We hope to thereby reduce problems especially for new students. For Digital Campus, COMSYS will refine this concept and implement a demonstrator for further development by experts from the domain of digital learning.

Digital Campus, funded by the Federal Ministry of Education and Research (BMBF) and implemented by the German Academic Exchange Service (DAAD), was a joint project with a runtime of one year, starting in February 2020.

Our Team



  • Yet to come


  • Roman Karwacik
  • Leon Schönbrunn


  For questions and inquiries regarding the project Digital Campus, please contact:

  Roman Matzutt
  Security and Privacy

  E-Mail: matzutt[at]

Related Publications

Proceedings of the 2022 IEEE International Conference on Blockchain and Cryptocurrency (ICBC '22), May 2-5, 2022, Shanghai, China
Publisher: IEEE,
May 2022
ISBN: 978-1-6654-9538-7/22
3. IEEE Transactions on Network and Service Management, 18(3):3064-3078
September 2021
ISSN: 1932-4537
Proceedings of the 15th ACM ASIA Conference on Computer and Communications Security (ASIACCS '20), October 5-9, 2020, Taipei, Taiwan, page 531-542.
Publisher: ACM,
October 2020
ISBN: 978-1-4503-6750-9/20/10
Proceedings of the 19th IFIP Networking 2020 Conference (NETWORKING '20), June 22-26, 2020, Paris, France, page 298-306.
Publisher: IEEE,
June 2020
ISBN: 978-3-903176-28-7
Export as:
- Impressum | Datenschutz -